Polish Scratch Simulation vs. Polish Tool Type

نویسندگان

چکیده

Wafer scratching from handling and processing can impact the performance of devices grown on a substrate. Knowledge process conditions modeling scratches wafers be used to elucidate root cause so that they eliminated.

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ژورنال

عنوان ژورنال: Materials Science Forum

سال: 2022

ISSN: ['1422-6375', '0250-9776', '0255-5476', '1662-9752', '1662-9760']

DOI: https://doi.org/10.4028/p-wkn17q